Through-silicon vias for 3d integration
Auteur :
Lau, John
Éditeur :
McGraw-Hill Education - Europe
ISBN :
9780071785143
Date de publication :
16 déc. 2012
Dimensions :
23,6 x 16,0 x 2,3 cm
Poids :
853 g
Langue :
Anglais
Pays d'origine :
USA
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits—essential for the development of low-cost, high-performance electronic and optoelectronic products.