Techniques and challenges for 300 mm silicon: processing, characterization, modelling and equipment: volume 81
Éditeur :
Elsevier Science & Technology
ISBN :
9780080436098
Date de publication :
8 sept. 1999
Dimensions :
27,9 x 21,0 cm
Poids :
670 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Includes papers that cover the E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment. This book covers a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, and wafer characterization.