Materials for high-density electronic packaging and interconnection
Auteur :
Committee on Materials for High-Density Electronic Packaging / Committee on Materials for High-Density Electronic PackagingCommission on Engineering and Technical Systems,National Materials Advisory Board,Division on Engineering and Physical Sciences,National Research Council,
Éditeur :
National Academies Press
ISBN :
9780309042338
Date de publication :
1 janv. 1990
Dimensions :
28,0 x 21,6 cm
Langue :
Anglais
Pays d'origine :
USA