Stress and strain engineering at nanoscale in semiconductor devices
Auteur :
Maiti, Chinmay K.
Éditeur :
Taylor & Francis Ltd
ISBN :
9780367519339
Date de publication :
25 sept. 2023
Dimensions :
23,4 x 15,6 cm
Poids :
220 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Based on 3D process and device simulations with mechanical stress simulations by finite element techniques, this book explains performance assessment of nanoscale devices with strained SiGe and other stressors. It explains the process-induced stress transfer and developments at 7nm technology and below node in the area of strain-engineered devices.