Avoiding inelastic strains in solder joint interconnections of ic devices
Auteur :
Suhir, Ephraim
Éditeur :
Taylor & Francis Ltd
ISBN :
9780367635886
Date de publication :
4 oct. 2024
Dimensions :
23,4 x 15,6 cm
Poids :
453 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.