Electrical conductive adhesives with nanotechnologies
Auteur :
Li, Yi (Grace) / Lu, Daniel / Wong, C.P.
Éditeur :
Springer-Verlag New York Inc.
ISBN :
9780387887821
Date de publication :
16 oct. 2009
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
USA
“Electrical Conductive Adhesives with Nanotechnologies†begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives).