Advanced materials for interconnections: volume 66
Auteur :
Gessner, Th.
Éditeur :
Elsevier Science & Technology
ISBN :
9780444205070
Date de publication :
18 déc. 1997
Dimensions :
22,9 x 15,2 cm
Poids :
1130 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Contains chapter related to Metallization that discusses cluster equipment for IC manufacturing, copper advanced technology, gap filling, mechanical reliability, deposition technology, electroless and electro-plating, copper metallization copper interconnects and patterning of aluminum. This book also covers Process Integration.