Electrical modeling and design for 3d system integration: 3d integrated circuits and packaging, signal integrity, power integrity and emc
Auteur :
Li, Er-Ping
Éditeur :
John Wiley & Sons Inc
ISBN :
9780470623466
Date de publication :
19 avr. 2012
Dimensions :
24,4 x 16,3 x 3,1 cm
Poids :
785 g
Langue :
Anglais
Pays d'origine :
USA
The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.