Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing
Auteur :
Liu, Shen / Liu, Yong
Éditeur :
John Wiley & Sons Inc
ISBN :
9780470827802
Date de publication :
21 oct. 2011
Dimensions :
21,0 x 15,0 x 2,5 cm
Poids :
1136 g
Format :
book
Langue :
Anglais
Pays d'origine :
Grande Bretagne
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.