Chemical mechanical planarization of microelectronic materials
Auteur :
Steigerwald, Joseph M. / Murarka, Shyam P. / Gutmann, Ronald J.
Éditeur :
John Wiley and Sons Ltd
ISBN :
9780471138273
Date de publication :
18 févr. 1997
Dimensions :
24,6 x 18,6 x 2,2 cm
Poids :
724 g
Langue :
Anglais
Pays d'origine :
USA
This text explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as oxide, tungsten, aluminum, copper and polysilicon which are used in the microelectronics industry.