Soldering in electronics assembly
Auteur :
JUDD, MIKE / Brindley, Keith
Éditeur :
Elsevier Science & Technology
ISBN :
9780750635455
Date de publication :
26 mars 1999
Dimensions :
23,4 x 15,6 cm
Poids :
880 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. This work provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for application; classification of assembly variants; and assessment and maintenance of solderability.