Benefiting from thermal and mechanical simulation in micro-electronics
Auteur :
Zhang, G.Q
ISBN :
9780792372783
Date de publication :
1 déc. 2000
Dimensions :
23,5 x 15,5 x 1,2 cm
Poids :
470 g
Format :
Laminated cover
Langue :
Anglais
Pays d'origine :
USA
Presents papers from the international conference on this topic, EuroSimE2000. This book discusses thermal and mechanical related problems and challenges in micro-electronics. It is useful for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.