Reliability, yield, and stress burn-in: a unified approach for microelectronics systems manufacturing and software development
Auteur :
Kuo, Way
Éditeur :
Kuo, WayChien, Wei-Ting Kary,Kim, Taeho,
ISBN :
9780792381075
Date de publication :
1 janv. 1998
Dimensions :
23,4 x 15,6 x 2,3 cm
Poids :
774 g
Format :
Laminated cover
Langue :
Anglais
Pays d'origine :
USA
Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.