Physical design for multichip modules
Auteur :
Sriram, Mysore
Éditeur :
Sriram, MysoreKang, Sung-Mo,
ISBN :
9780792394501
Date de publication :
25 mars 1994
Dimensions :
23,4 x 15,6 x 1,4 cm
Poids :
488 g
Format :
Laminated cover
Langue :
Anglais
Pays d'origine :
USA
Presents research work that has been conducted in the area of Multichip Module (MCM) design. This book presents an overview of the different MCM technologies. It discusses the various approaches to interconnect analysis. It also discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance.