Micromachined devices and components: v. 4
Auteur :
French, Patrick J.
ISBN :
9780819429735
Date de publication :
31 mai 1999
Dimensions :
23,0 cm
Langue :
Anglais
Pays d'origine :
USA
An assessment of micromachined devices and components. It contains discussion of bonding and packaging, including wafer bonding with an adhesive coating, and examination of chemical and gas sensors, including acoustic-wave chemical microsensors in GaAs.