Food packaging science and technology
Auteur :
Lee, Dong Sun / Yam, Kit L. / Piergiovanni, Luciano
Éditeur :
Taylor & Francis Inc
ISBN :
9780824727796
Date de publication :
1 avr. 2008
Dimensions :
23,4 x 15,6 cm
Poids :
1560 g
Langue :
Anglais
Pays d'origine :
USA
Offers coverage of packaging materials and their properties, industry operations, emerging technologies, active and intelligent packaging. This book features developments in food package concepts and practices, as well as scientific and technical papers.