Hybrid assemblies and multichip modules
Auteur :
Kear, Fred W.
Éditeur :
Taylor & Francis Inc
ISBN :
9780824784669
Date de publication :
16 déc. 1992
Dimensions :
23,4 x 15,6 cm
Poids :
635 g
Langue :
Anglais
Pays d'origine :
USA
Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.