Thermal design of electronic equipment
Auteur :
Remsburg, Ralph
Éditeur :
Taylor & Francis Inc
ISBN :
9780849300820
Date de publication :
27 sept. 2000
Dimensions :
23,4 x 15,6 cm
Poids :
808 g
Langue :
Anglais
Pays d'origine :
USA
Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.