Ceramic interconnect technology handbook
Éditeur :
Taylor & Francis Inc
ISBN :
9780849335570
Date de publication :
24 janv. 2007
Dimensions :
23,4 x 15,6 cm
Poids :
783 g
Langue :
Anglais
Pays d'origine :
USA
Offers coverage of various aspects of ceramic interconnect technologies in electronics and electronic packaging. This book discusses trends in electronic packaging, electrical design, simulation, and testing, ceramic materials, and the various types of ceramic interconnects, devices, and applications.