Electronic packaging materials and their properties
Auteur :
Pecht, Michael / Agarwal, Rakish / McCluskey, F. Patrick / Dishongh, Terrance J. / Javadpour, Sirus / Mahajan, Rahul
Éditeur :
Taylor & Francis Inc
ISBN :
9780849396250
Date de publication :
18 déc. 1998
Dimensions :
23,4 x 15,6 cm
Poids :
362 g
Langue :
Anglais
Pays d'origine :
USA
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.