Thermal and structural electronic packaging analysis for space and extreme environments
Auteur :
Cepeda-Rizo, Juan / Gayle, Jeremiah / Ravich, Joshua
Éditeur :
Taylor & Francis Ltd
ISBN :
9781032160856
Date de publication :
26 août 2024
Dimensions :
23,4 x 15,6 cm
Poids :
460 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.