Nano-interconnect materials and models for next generation integrated circuit design
Éditeur :
Taylor & Francis Ltd
ISBN :
9781032363813
Date de publication :
22 déc. 2023
Dimensions :
23,4 x 15,6 cm
Poids :
489 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
This book deals with various new generation interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis.