Elements of electromigration: electromigration in 3d ic technology
Auteur :
Tu, King-Ning / Liu, Yingxia
Éditeur :
Taylor & Francis Ltd
ISBN :
9781032470276
Date de publication :
19 janv. 2024
Dimensions :
24,6 x 17,4 cm
Poids :
640 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.