Direct copper interconnection for advanced semiconductor technology
Éditeur :
Taylor & Francis Ltd
ISBN :
9781032528403
Date de publication :
21 mai 2026
Dimensions :
23,4 x 15,6 cm
Poids :
850 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
In the “More than Moore†era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.