Materials for advanced semiconductor packaging and heterogeneous integration
Éditeur :
Taylor & Francis Ltd
ISBN :
9781032959436
Date de publication :
20 oct. 2026
Dimensions :
23,4 x 15,6 cm
Poids :
453 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.