Chemical-mechanical polishing 2000 – fundamentals and materials issues: volume 613
Éditeur :
Cambridge University Press
ISBN :
9781107413146
Date de publication :
5 juin 2014
Dimensions :
22,9 x 15,2 x 1,0 cm
Poids :
240 g
Format :
Trade paperback (US)
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.