Introduction to microsystem packaging technology
Auteur :
Jin, Yufeng / Wang, Zhiping / Chen, Jing
Éditeur :
Taylor & Francis Inc
ISBN :
9781439819104
Date de publication :
29 sept. 2010
Dimensions :
25,4 x 17,8 cm
Poids :
680 g
Langue :
Anglais
Pays d'origine :
USA
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.