Advanced flip chip packaging
Éditeur :
Springer-Verlag New York Inc.
ISBN :
9781441957672
Date de publication :
21 mars 2013
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
USA
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.