Advanced materials for thermal management of electronic packaging
Auteur :
Tong, Xingcun Colin
Éditeur :
Springer-Verlag New York Inc.
ISBN :
9781441977588
Date de publication :
10 janv. 2011
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
USA
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance.