Packaging of high power semiconductor lasers
Auteur :
Liu, Xingsheng / Zhao, Wei / Xiong, Lingling / Liu, Hui
Éditeur :
Springer-Verlag New York Inc.
ISBN :
9781461492627
Date de publication :
15 juil. 2014
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
USA
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.