Istfa 2021: conference proceedings from the 47th international symposium for testing and failure analysis
Auteur :
ASM International
Éditeur :
A S M International
ISBN :
9781627084192
Date de publication :
30 juil. 2022
Poids :
1152 g
Langue :
Anglais
Pays d'origine :
USA
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.