3d interconnect architectures for heterogeneous technologies: modeling and optimization
Auteur :
Bamberg, Lennart / Joseph, Jan Moritz / GarcÃa-Ortiz, Alberto / Pionteck, Thilo
Éditeur :
Springer Nature Switzerland AG
ISBN :
9783030982317
Date de publication :
29 juin 2023
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.