Three-dimensional integration and modeling: a revolution in rf and wireless packaging
Auteur :
Lee, Jong-Hoon / Tentzeris, Manos M.
Éditeur :
Springer International Publishing AG
ISBN :
9783031005756
Date de publication :
31 déc. 2007
Dimensions :
23,5 x 19,1 cm
Langue :
Anglais
Pays d'origine :
Suisse
Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References