Introduction to microelectronics advanced packaging assurance
Auteur :
Asadizanjani, Navid / Reddy Kottur , Himanandhan / Dalir, Hamed
Éditeur :
Springer International Publishing AG
ISBN :
9783031861017
Date de publication :
23 avr. 2025
Dimensions :
24,0 x 16,8 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging.