Cmos plasma and process damage
Auteur :
Prall, Kirk
Éditeur :
Springer International Publishing AG
ISBN :
9783031890284
Date de publication :
17 mai 2025
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.