Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
Auteur :
Hwang, Jennie S.
Éditeur :
Springer
ISBN :
9789401160520
Date de publication :
20 févr. 2012
Dimensions :
22,9 x 15,2 cm
Langue :
Anglais
Pays d'origine :
Nederlands
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.