Multichip modules
Auteur :
Kuh, Ernest S.
ISBN :
9789810209254
Date de publication :
3 janv. 1992
Dimensions :
22,0 cm
Langue :
Anglais
Pays d'origine :
Singapour
Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints.