High performance design automation for multi-chip modules
Auteur :
Cho, J.D.
ISBN :
9789810223076
Date de publication :
6 janv. 1996
Dimensions :
22,0 cm
Langue :
Anglais
Pays d'origine :
Singapour
The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment.