3d microelectronic packaging: from architectures to applications
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811570926
Date de publication :
24 nov. 2021
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.