Transactions on engineering technologies: world congress on engineering 2019
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811582752
Date de publication :
26 oct. 2021
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications.