Transactions on engineering technologies: world congress on engineering and computer science 2019
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811592119
Date de publication :
6 janv. 2022
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book contains a selection of revised and extended research articles written by prominent researchers participating in the 27th World Congress on Engineering and Computer Science (WCECS 2019) which was held in San Francisco, USA, on October 22–24, 2019.