Electromigration modeling at circuit layout level
Auteur :
Tan, Cher Ming / He, Feifei
Éditeur :
Springer Verlag, Singapore
ISBN :
9789814451208
Date de publication :
4 mai 2013
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.