Proceedings of the green materials and electronic packaging interconnect technology symposium: epits 2024, 26-27 august, ho chi minh city, vietnam
Éditeur :
Springer Nature Switzerland AG
ISBN :
9789819628704
Date de publication :
12 mars 2025
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology.