Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration
Auteur :
Lau, John / Fan, Xuejun
Éditeur :
Springer Nature Switzerland AG
ISBN :
9789819641659
Date de publication :
19 mai 2025
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.