Signal processing, telecommunication and embedded systems with ai and ml applications: proceedings of 8th international conference on microelectronics electromagnetics and telecommunications (icmeet 2023)
Éditeur :
Springer Verlag, Singapore
ISBN :
9789819784219
Date de publication :
11 déc. 2024
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 – 7 October 2023.