Microwave and millimeter-wave chips based on thin-film integrated passive device technology: design and simulation
Auteur :
Wu, Yongle / Wang, Weimin
Éditeur :
Springer Verlag, Singapore
ISBN :
9789819914579
Date de publication :
3 juin 2024
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.