Interconnect technologies for integrated circuits and flexible electronics
Éditeur :
Springer Verlag, Singapore
ISBN :
9789819944750
Date de publication :
22 sept. 2023
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics.