Materials for high-density electronic packaging and interconnection
Auteur :
National Research Council / Division on Engineering and Physical Sciences / National Materials Advisory Board / Commission on Engineering and Technical Systems / Committee on Materials for High-Density Electronic Packaging
Éditeur :
National Academies Press
ISBN :
9780309042338
Date de publication :
1 févr. 1990
Dimensions :
27,9 x 21,6 cm
Langue :
Anglais
Pays d'origine :
USA