Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement
Auteur :
Ma, Yue / Gontrand, Christian
Éditeur :
Taylor & Francis Ltd
ISBN :
9780367023430
Date de publication :
28 mars 2019
Dimensions :
23,4 x 15,6 cm
Poids :
510 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
New insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.