Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging
Auteur :
Wei, Xing-Chang
Éditeur :
Taylor & Francis Ltd
ISBN :
9780367573669
Date de publication :
30 juin 2020
Dimensions :
23,4 x 15,6 cm
Poids :
453 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power